Home >> Nonmetallic materials >> Organosilicon adhesive TsMK- 20 (TU 2252-327-07500935-2001)

Organosilicon adhesive TsMK- 20 (TU 2252-327-07500935-2001)

Purpose:

Bonding together and in various combinations metals, structural glass fiber plastics, carbon fiber-reinforced plastics with heat-resistant sheet heat-protective materials, details from silicon rubber, rubberized fabrics, heat-insulating materials.

Application:

The adhesive is characterized by high endurance to cyclic temperature action and vibrations.

Technical and performance characteristics:

Tear-off strength, MPa

(AMg6 – AMg6)

at 20 °С

not less than 0.8

Operating temperature range

from – 90 to +300 °С






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